Excellence in Research and Innovation for Humanity

International Science Index

Commenced in January 1999 Frequency: Monthly Edition: International Paper Count: 2

2
3230
Control of Thermal Flow in Machine Tools Using Shape Memory Alloys
Abstract:

In this paper the authors propose and verify an approach to control heat flow in machine tool components. Thermal deformations are a main aspect that affects the accuracy of machining. Due to goals of energy efficiency, thermal basic loads should be reduced. This leads to inhomogeneous and time variant temperature profiles. To counteract these negative consequences, material with high melting enthalpy is used as a method for thermal stabilization. The increased thermal capacity slows down the transient thermal behavior. To account for the delayed thermal equilibrium, a control mechanism for thermal flow is introduced. By varying a gap in a heat flow path the thermal resistance of an assembly can be controlled. This mechanism is evaluated in two experimental setups. First to validate the ability to control the thermal resistance and second to prove the possibility of a self-sufficient option based on the selfsensing abilities of thermal shape memory alloys.

1
6704
Loop-free Local Path Repair Strategy for Directed Diffusion
Abstract:
This paper proposes an implementation for the directed diffusion paradigm aids in studying this paradigm-s operations and evaluates its behavior according to this implementation. The directed diffusion is evaluated with respect to the loss percentage, lifetime, end-to-end delay, and throughput. From these evaluations some suggestions and modifications are proposed to improve the directed diffusion behavior according to this implementation with respect to these metrics. The proposed modifications reflect the effect of local path repair by introducing a technique called Loop-free Local Path Repair (LLPR) which improves the directed diffusion behavior especially with respect to packet loss percentage by about 92.69%. Also LLPR improves the throughput and end-to-end delay by about 55.31% and 14.06% respectively, while the lifetime decreases by about 29.79%.
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