Excellence in Research and Innovation for Humanity

Mihai Branzei

Publications

2

Publications

2
8439
Structure Improvement of Aluminothermic Welding Joints by Using Modifiers
Abstract:
Aluminothermic rail welding was from the beginning a great success because its low price even in 1895 in Germany. This method is now, widely used all over the world for the railways construction, maintenance and modernization. Instructions give you guidelines for preparing papers for conferences or journals. After 1989, the welding needs of the potentials beneficiaries (Romanian Railways, Urban Transportation Companies) keep raise because of the railways maintenance and modernization necessity. The main materials that determine the Thermit (T) composition result from manufacturing scraps all over the country. This can help the environment by consuming these scraps. The Romanian need for alumino-thermic welding is now by 11300 per year, and in a favourable economical environment, this amount can reach 30000 units. This paper tries to show the effect of two types of modifiers introduced in the T composition on the structure and properties of an alumino-thermic welding.
Keywords:
aluminothermic rail welding, modifier, Thermit.
1
14796
The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure
Abstract:
The Pads have unique values of thermophysical properties (THP) having important contribution over heat transfer into the PCB structure. Materials with high thermal diffusivity (TD) rapidly adjust their temperature to that of their surroundings, because the HT is quick in compare to their volumetric heat capacity (VHC). In the paper is presenting the diffusivity tests (ASTM E1461 flash method) for PCBs with different core materials. In the experiments, the multilayer structure of PCBA was taken into consideration, an equivalent property referring to each of experimental structure be practically measured. Concerning to entire structure, the THP emphasize the major contribution of substrate in establishing of reflow soldering process (RSP) heat transfer necessities. This conclusion offer practical solution for heat transfer time constant calculation as function of thickness and substrate material diffusivity with an acceptable error estimation.
Keywords:
heat transfer time constant, packaging, reflowsoldering process, thermal diffusivity.