Conference Code: 14ES02ICTE
Conference Aims and Objectives
The ICTE 2014: 16th International Conference on Thermal Engineering
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Thermal Engineering. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Thermal Engineering.
Call for Contributions
All honorable authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Thermal Engineering are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.WASET
All submitted conference papers will be blind peer reviewed by three competent reviewers. The post conference proceedings will be abstracted and indexed in the International Science Index
, and submitted to be indexed in the
, Scopus and Thomson Reuters. The conference abstracts and proceedings book, CD and certificate of presentation will be distributed to participants at the conference registration desk.
Special Journal Issues
ICTE 2014 has teamed up with the Special Journal Issue on Thermal Engineering
A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form
|Abstracts/Full-Text Paper Submission Deadline
||January 10, 2014
|Notification of Acceptance
||January 20, 2014
|Final Paper (Camera Ready) Submission & Early Bird Registration Deadline
||January 31, 2014
||February 27 - 28, 2014
Please ensure your submission meets WASET's strict guidelines for accepting scholarly papers. View downloadable versions of the check list for
Please refer to the Paper Submission GUIDE
before submitting your paper.
Selected Conference Papers
1) Performance Analysis of Modified Solar Water Heating System for Climatic Condition of Allahabad, IndiaKirti Tewari, Rahul Dev 2) Free Convection in a Darcy Thermally Stratified Porous Medium That Embeds a Vertical Wall of Constant Heat Flux and ConcentrationMaria Neagu 3) Thermal Fatigue Behavior of 400 Series Ferritic Stainless SteelsSeok Hong Min, Tae Kwon Ha 4) Characterization of the Airtightness Level in School Classrooms in Mediterranean ClimateMiguel A. Campano, Jesica Fernández-Agüera, Samuel Domínguez-Amarillo, Juan J. Sendra 5) Thermal Analysis of Photovoltaic Integrated Greenhouse Solar DryerSumit Tiwari, Rohit Tripathi, G. N. Tiwari 6) Performance of Partially Covered N Number of Photovoltaic Thermal (PVT) - Compound Parabolic Concentrator (CPC) Series Connected Water Heating SystemRohit Tripathi, Sumit Tiwari, G. N. Tiwari 7) UV-Cured Coatings Based on Acrylated Epoxidized Soybean Oil and Epoxy CarboxylateAlaaddin Cerit, Suheyla Kocaman, Ulku Soydal 8) Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation ToolB. Arzhanov, A. Correia, P. Delgado, J. Meireles 9) Thermomechanical Coupled Analysis of Fiber Reinforced Polymer Composite Square Tube: A Finite Element StudyM. Ali, K. Alam, E. Ohioma 10) Acoustic and Thermal Isolation Performance Comparison between Recycled and Ceramic Roof Tiles Using Digital Holographic InterferometryA. Araceli Sánchez, I. Manuel H. De la Torre, S. Fernando Mendoza, R. Cesar Tavera, R. Manuel de J. Briones 11) Monitorization of Junction Temperature Using a Thermal-Test-DeviceB. Arzhanov, A. Correia, P. Delgado, J. Meireles 12) Effect of Collector Aspect Ratio on the Thermal Performance of Wavy Finned Absorber Solar Air HeaterAbhishek Priyam, Prabha Chand 13) A Comparative Study of Afghan Traditional and Contemporary Courtyard Housing Regarding Affordable Planning and SustainabilityMohammad Saraj Sharifzai, Keisuke Kitagawa, Mohammad Kamil Halimee, Javid Habib, Daishi Sakaguchi 14) Measurement of Acoustic Loss in Nano-Layered Coating Developed for Thermal Noise ReductionE. Cesarini, M. Lorenzini, R. Cardarelli, S. Chao, E. Coccia, V. Fafone, Y. Minenkow, I. Nardecchia, I. M. Pinto, A. Rocchi, V. Sequino, C. Taranto 15) A Review on Thermal Conductivity of Bio-Based Carbon NanotubesGloria A. Adewumi, Andrew C. Eloka-Eboka, Freddie L. Inambao